Polaris, the company’s first-generation mSoC, will be able to drop into new Mercedes vehicles. It includes three compute die, a cache in the center (DreamBig Semiconductor’s chiplet hub) and a full-fledged NPU from an undisclosed supplier that will support all ML operators. All these chiplets are from third-party suppliers (none are made in-house).

Compute die are coming from a supplier who already makes automotive-grade SoC chips – this is the first time this particular supplier is offering chiplets, Athos CTO François Piednoël told EE Times.