| | | [News] Meta Reportedly Weighs Google TPU Deployment in 2027, Boosting Broadcom, Taiwan’s GUC
Meta Reportedly Weighs Google TPU Deployment in 2027, Boosting Broadcom, Taiwan’s GUC
2025-11-25 Emerging Technologies / Semiconductors
Please note that this article cites information from Bloomberg, The Information, Investing.com, Commercial Times, and Anue.
As major U.S. cloud providers ramp up their AI ASIC efforts to lessen dependence on NVIDIA, Meta is reportedly evaluating to spend billions on Google’s in-house AI chips. According to Bloomberg, citing The Information, Meta is in talks to deploy Google’s TPUs in its data centers starting in 2027 and may also rent the chips through Google Cloud as early as 2026.
For years, Google limited its TPUs to its own cloud, offering them solely as rented compute for large-scale AI workloads. But Investing.com, citing The Information, notes that Google is now promoting the chips for installation directly inside customers’ data centers—a significant strategic shift that intensifies its competition with NVIDIA.
Investing.com also reports that Google Cloud executives view broader TPU adoption as a route to capturing up to 10% of NVIDIA’s annual revenue, representing a multibillion-dollar opportunity.
The potential Meta–Google deal is additionally expected to give Broadcom a substantial lift. According to TrendForce, Google is partnering with Broadcom on the TPU v7p (Ironwood), an optimized platform for training, set to expand in 2026 and succeed the TPU v6e (Trilium). TrendForce predicts Google’s TPU shipments will stay the highest among CSPs, with over 40% annual growth in 2026.
Taiwanese Suppliers Gain Momentum from Google’s TPU Expansion
Google’s TPU drive is expected to boost several Taiwanese firms, increasing demand for ASIC design services from TSMC affiliate Global Unichip (GUC) and others, according to Commercial Times. As Anue notes, Google is strengthening its in-house chip platform through a partnership with GUC on N3 and N5 process-node design services, spanning next-generation processors such as TPUs and the Axion CPU. Additionally, the outlet further states that TPU v7 shipments began in the second quarter and will ramp up in the second half, with demand expected to rise further in 2026. This positions Taiwan’s supply chain for meaningful gains across PCB makers, CCL materials, thermal modules, and testing equipment.
PS
What I read.
EUV chips becoming more and more lucrative.
Capital seeks best returns.
ArFi/EUV bonanza JUST started.
ASML has many revenue streams flowing quite nicely.
With Village all in.
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