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... This week ASMLF introduced their i-line step and scan system. While this has nothing to do with DUV at the present, ...
As I understand it, the new ASML i-line step-and-scan is directed specifically to combined DUV/i-line mix-and-match fabs. It is the advent of DUV that has created the need of more precise field registration i-line steppers such as the new ASML PAS 5500/400 tool just announced. While DUV step and scan could do the work of both i-line and DUV, it is more cost effective to use mix-and-match DUV (for the critical dimensions) and i-line (for noncritical dimensions). The mix-and-match process yields higher throughput than would an all-DUV litho process, and the i-line stepper costs $1 million less than the DUV stepper.
My guess is that as the demand increases for more critical (smaller) dimensioned ICs mix-and-match will more closely resemble all DUV; and at some point i-line will be phased out or relegated to less demanding litho applications (refrigerator ICs) or, if practical, retrofitted with DUV laser and optics.
As I and others indicated in earlier posts the ratio of new orders for i-line/DUV steppers has gone from 3:1 in mid 97' to 1:1 end 97', and more recently it appears that more DUV than i-line tools are being ordered. Hyundai, for example, recently changed its original ASML order of last fall from 3:1 i-line:DUV steppers to DUV-only steppers (for same $ amount originally contracted).
Message 3517391
Combined with the .08 micron achievement with optical litho this sure cements Cymer's position as the "Intel" of litho illumination source for the next 10 years. JMAR et al with their competing XRL, e-beam, ion-beam are going to have to wait a mighty long time before being invited to the dance. Cymer's Bob Akins prophetically said as much last September.
Tulvio
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