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Technology Stocks : AMD, ARMH, INTC, NVDA

AMD 210.15

+4.6%

10:40 AM EST

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To: Joe NYC who wrote (72747)	12/4/2025 5:44:52 PM
From: Pravin Kamdar	Read Replies (1) of 73030

Intel can compete with 2.5 and 3D packaging. Hence the new Malaysia fab. Sure Trump doesn't like that. Maybe 18AP and 14A are doing well. All the news is about Apple. From what I can tell, Apple may be considering Intel for their lowest end chips. To be a broken record, the reality is that without the EUV steppers, it's just an exercise of capability -- with no way of large scale production.

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