CMP Slurry and Pads Market Set for 6% Growth [not getting "concerns" memo]
Shannon Davis
1 week ago
"Despite trade tensions and rare-earth dependencies, AI-driven semiconductor production continues to sustain robust CMP demand worldwide."
The CMP slurry and pad market is forecasted to grow 6% in 2025 to approximately $3.6 billion USD, driven by recovery in logic segments and expanding CMP process steps across next generation device technologies and advanced packaging. Slurries are expected to total $2.14B and pads $1.46B, together reflecting a CAGR of 8.6% through 2029. Growth is being fueled by advanced 3D NAND, FinFET 3nm, GAA, and emerging backside power delivery structures, all requiring more CMP steps per wafer to achieve superior planarity and performance according to TECHCET’s 2025-2026 Critical Materials Report on CMP.
Advanced packaging adoption, rising from 36% of total packaging in 2023 to 46% by 2029, is increasingly blurring the boundary between fab and packaging operations, introducing new CMP applications in FOWLP and 3D TSV structures. TECHCET is active in analysis of advanced packaging CMP applications, reflecting the growing impact of advanced packaging demand on overall consumables demand and industry modeling.
On the Front End, technology shifts to Gate-All-Around (GAA), Backside Power Delivery (BPD), and new metal interconnects (Co, Mo, Ru) are also contributing to this expansion. Supplier activity remains strong: Entegris announced a $700M U.S. R&D investment and Fujifilm expanded slurry production in Belgium and Japan while DuPont, Anji, and Hubei Dinglong reported record growth. Despite trade tensions and rare-earth dependencies, AI-driven semiconductor production continues to sustain robust CMP demand worldwide. For more details on drivers and trends in CMP, go to www.techcet.com. |
