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Politics : Formerly About Advanced Micro Devices

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To: Paul Engel who wrote (29114)2/27/1998 2:54:00 PM
From: Larry Loeb  Read Replies (2) of 1573703
 
The evidence seems to point to the yield problems being from a design layout that was too aggressive (low margin of error).

Specifically:
- it appears that the former NexGen designer (I can't remember his name) was forced out;

- the problems seem to persist; and

- the agreement with IBM (considering the expected capacities of AMD's existing and planned facilities).

How long does it take to create a new, less aggressive layout and what do you think would be the resulting good die per wafer (better yield versus bigger size)?

Also, what would be the impact on the speed of the K6?

By the way, the article on C/Net said that IBM was making the K6. I thought they were just taking the processed wafers and packaging them. Is my recollection correct?

Larry
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