LSI Logic Introduces 1024-I/O Organic Laminate Flip-Chip Packages
Wednesday March 4, 6:00 am Eastern Time
High Lead Counts, Power, and Ground Regions Satisfies the Demand
for Multiple Voltage Packages for Deep Submicron Chips
MILPITAS, Calif., March 4 /PRNewswire/ -- LSI Logic Corporation
(NYSE: LSI - news) today announced that it is the first to offer a
complete family of flip-chip ASICs in packages using organic
laminate substrates to produce up to 1024-I/O high performance
packages. Organic laminate flip-chip substrates provide excellent
performance, high board level reliability, and low costs compared
to ceramic materials currently used for many IC packages. Laminate
materials significantly reduce noise and improve overall system
performance.
''LSI Logic's qualification of organic laminate substrates has been
a significant achievement,'' said Ronnie Vasishta, director of ASIC
marketing at LSI Logic. ''Having the package substrate match the end
user's motherboard in thermal coefficient of expansion provides for
enhanced board level reliability and allows packages up to 45-mm on
edge for a standard eutectic ball grid array. This means that a
standard package can have up to 1732-balls or 1024-I/Os. Copper is
used for signal distribution in the package because of its lower in
resistance than the interconnect metallization used in ceramic
packages.
''Customers no longer have to deal with expensive ceramic substrates
or costly socket/land grid configurations. They get improved
performance due to the lower dielectric constant of the substrate
material, plus lower component costs, with better power handling,''
added Vasishta.
Organic flip-chip packages are designed with split power and ground
regions to meet the increasing demand for mixed voltage solutions.
Core voltages continue to decrease for performance and power
consumption reasons, while the I/O voltages continue at higher
levels. This demands a standard package with built-in flexibility
to provide low inductance planes for a variety of reference
voltages, while designing I/O traces with the tightest rules
possible to avoid increasing the chip size to fit the package.
Qualification of the Organic Flip-Chip packages is complete, and
these packages can be designed into systems starting in the second
quarter of 1998. Price is dependent on the complete scope of the
ASIC design and the production quantities ordered. LSI Logic does
not sell packages separately from its ASIC products.
Standard Organic Flip-Chip Packages offered by LSI Logic.
Ball.....Body
Count....Size...# I/O......Array....Vss...Vdd...VssC...VddC
....792......31......504....30 x 30....126....126.......18.......18
....964......35......600....34 x 34....150....150.......32.......32
...1161......40......720....39 x 39....180....180.......41.......40
...1417......40......864....39 x 39....216....216.......61.......60
...1732*....45.....1024....44 x 44....256....256.......98.......98
* The 45-mm package qualification scheduled to be completed by 3Q98.
LSI Logic Corporation, The System on a Chip Company(TM), is a
leading supplier of custom high-performance semiconductors, with
operations worldwide. The company enables customers to build
complete systems on a single chip with its CoreWare(R) design
program, thereby increasing performance, lowering system costs and
accelerating time to market. LSI Logic develops application-
optimized products in partnership with trendsetting customers, and
operates leading-edge, high-volume manufacturing facilities to
produce submicron chips. The company maintains a high level of
quality, as demonstrated by its ISO 9000 certifications. LSI Logic
is headquartered at 1551 McCarthy Blvd., Milpitas, California 95035,
408-433-8000, lsilogic.com.
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