I would like to encourage everyone here to become proactive in carrying out DD, and to share the results on this thread. We can join our efforts and ideas to produce results.
In the past I worked with the Symetrix/Matsushita team in developing (I was on the sales side) a ferroelectric/high-dielectric film deposition system, so I am somewhat familiar with the background.
It seems we have two camps, those using the name FeRAM (Y-1) and those using the name FRAM(PZT). Originally, PZT had a technical problem, which I believe was fatigue. Y-1 was then discovered and marketed as a ferroelectric material that did not have a fatigue problem.
However, I think that Ramtron/Rohm overcame the fatigue problem by optimizing the electrode material (I am speaking from memory, may be wrong). This is validated by the facts:
1. ROHM is now in production of FRAM devices in some volume. They wouldn't do this if there was a fatigue problem. Please verify w/Ramtron.
2. RCOM guarantees I believe 10 billion write cycles, which would not work with fatigue problems.
We need to do DD to verify:
1. Are Y-1 and PZT now similar in performance for smart cards?
2. How are the other projects for RCOM coming along?
3. How are negotiations with Sun (JavaSoft) and Mondex International coming along?
4. Financial details of the Hitachi deal, etc.
Now if everyone on the thread can start calling RCOM, Ramtron, Sun, and Mondex, then we can probably gather LOTS of information and solidify our confidence in this co.
If they do get a significant portion of the smart card market, this could be huge.
I look forward to everyone's aggressive participation.
Good luck,
THC |
