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Technology Stocks : Intel Corporation (INTC)
INTC 41.41+2.2%Dec 5 9:30 AM EST
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To: Joe NYC who wrote (49850)3/6/1998 11:25:00 AM
From: John Donahoe  Read Replies (1) of 186894
 
Power Dissipation is a factor in determining a chips reliability. However it's not the only one. The most important factor affecting a chip's reliability is its internal temperature which is a function of mechanical issues (i.e. packaging and heatsinking) in addition to chip power dissipation.

I'm assuming they are comparing apples with apples (i.e. all running at the same supply voltage).

However there may be differences in the size of the CPU's package and the CPU's thermal mounting plate which could result in differences in thermal resistance which has a direct effect on internal temperatures.

Without understanding the details to each companies approach to thermal management it's hard to determine the affect on reliability.

Best way is to perform reliability tests. Accelerated life tests on a sample set of CPUs running in their intended thermal/mechanical environment would be very interesting.

JD

PS: Someone mentioned Cyrix applying thermal "goop" to their CPU's.
This sounds very klugy. It normally indicates problems in heat sinking.
"Goop" over comes irregularities in a device's thermal mounting plate's (TMP) flatness. A TMP should be as uniformally flat as possible to insure good contact with the heatsink thus reducing thermal resistance.
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