LSI Logic Defines the Future of System-on-a-Chip
SOURCE: LSI Logic Corporation - Monday March 23, 6:01 am Eastern Time
G12(TM) Technology Sets New System-on-a-Chip Standards by Fusing r-f,
Mixed-Signal, Logic, IP, and Embedded Memory on One Chip.
MILPITAS, Calif., March 23 /PRNewswire/ -- LSI Logic Corporation
(NYSE: LSI - news) today introduced G12(TM), a new system-on-a-chip
technology capable of combining all of the system functions needed to
create totally new classes of communications, computer, and consumer
products on one silicon chip. The 0.13-micron Leff (0.18-micron drawn)
G12(TM) technology offers 26,000,000 usable logic gates on a tiny 20-
by 20-millimeter silicon chip; that's more system-on-a-chip capability
than has ever been available on this size chip.
''The G12(TM) technology is an unprecedented extension of our system-
on-a-chip technology, that defines the highest system performance and
density,'' said Wilfred J. Corrigan, LSI Logic Chairman and CEO. ''The
G12 technology sets completely new levels of integration and performance
empowering our customers to create system-on-a-chip products never before
possible on one silicon chip.''
This G12 breakthrough technology product is the fourth generation
system-on-a-chip technology created by LSI Logic, and it provides
electronic system designers with densities of 65,000 usable logic gates
per square millimeter. This makes possible the inclusion of vast numbers
of CoreWare(R) IP functions to supply all of the system level components for immediate inclusion into system-on-a-chip designs.
''Since producing our first high-volume system-on-a-chip design for
the Sony Playstation in 1993, LSI Logic has consistently set the
industry pace in delivering ever more complex system level products,''
said John P. Daane, LSI Logic executive vice president for ASIC,
communications, and computer products. ''In the past five years, our
system-on-a-chip strategy has evolved from providing complex ASIC
designs to delivering system-on-a-chip products that include a
combination of complex silicon, operating systems, and applications
software to complete the system like our GSM, DVD, and Digital camera
systems on a chip. For the first time, G12 technology enables us to
bring all system elements that formerly were separate components onto
a chip that defines the architecture of the system,'' added Daane.
''Our ASIC heritage gives us the added element of very fast design and
production turnaround to greatly improve time to market for our
customer's products.''
''Another product innovation is the use of low-K dielectric in the
metalization. This material was selected to improve signal integrity
and reduce timing delays caused by interconnections. It enables high
performance as well as more accurate timing closure for complex
designs,'' said Ronnie Vasishta, director of ASIC Technical Marketing.
''Using a very aggressive interconnect metal pitch of 0.63-micron
fully contacted results in a 50-percent reduction in the cell size
versus the previous generation technology. More porous cells result in
nearly three times the density of the company's G11(TM) technology.''
G12 is a complete system-on-a-chip technology with a choice of two low
current leakage transistors for portable/battery operated systems;
first, a one-volt transistor that consumes only 7.1-nanoWatts/gate/MHz
(a nanowatt is one billionth of a watt), and second, 1.8-volt transistors
for high performance applications dissipating 23-nW/gate/MHz. Both
transistor types can be placed on the same chip. G12 technology offers
the high performance and density needed to serve both the high speed
computer and the low-power portable consumer and communications
markets.
Prototype designs using the G12 technology will begin in the fourth
quarter of 1998. Initial production for the G12 product will start
in the second quarter of 1999.
LSI Logic Corporation, The System on a Chip Company(R), is a leading
supplier of custom high-performance semiconductors, with operations
worldwide. The company enables customers to build complete systems on
a single chip with its CoreWare(R) design program, thereby increasing
performance, lowering system costs and accelerating time to market.
LSI Logic develops application- optimized products in partnership with
trendsetting customers, and operates leading-edge, high-volume
manufacturing facilities to produce submicron chips. The company
maintains a high level of quality, as demonstrated by its ISO 9000
certifications. LSI Logic is headquartered at 1551 McCarthy Blvd.,
Milpitas, California 95035, 408-433-8000, lsilogic.com.
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