To All:
Canon Semiconductor
Introduces High Productivity i-Line Lithography Stepper
ÿÿÿÿBusiness Editors
ÿÿÿÿSANTA CLARA, Calif.--(BUSINESS WIRE)--March 23, 1998--Canon U.S.A., Inc.,
Semiconductor Equipment Division, is augmenting its microlithography product line-up with
a new high productivity i-line stepper that delivers enhanced optical performance, better
overlay and higher throughput -- the FPA-3000i5+.
ÿÿÿÿBased on the field-proven FPA-3000i5 chassis, the new Canon stepper includes a high
numerical aperture (NA 0.63) and the ability to print features smaller than 0.35 microns,
making it ideal for the volume manufacturing of 64 Mb and higher DRAMs.
ÿÿÿÿCanon has designed the new i5+ as a mix-and-match companion for its FPA-3000EX5
DUV stepper. The two models together will provide a high productivity option for those
companies wanting extend their current asset base by staying with 5X (5:1 reduction ratio)
steppers as long as possible.
ÿÿÿÿNew and improved features of the FPA-3000i5+ boost its throughput beyond 100
wafers per hour on 8-inch wafers -- an increase of approximately 25% over its predecessor.
ÿÿÿÿThe new model includes Canon's fast linear motor air-guided tilting (FLAT) stage, plus
a newly added "Smoothing Focus" feature that operates on-the-fly to maximize throughput by
beginning focus measurement and stabilization during stage-stepping. An improved advanced
global alignment (AGA) scheme further reduces measurement time. The FPA-3000i5+ also
offers increased illumination intensity. Other design modifications of the FPA-3000i5+,
including improved active damper pressure control, acceleration feedback and thermal
temperature control, have resulted in increased accuracy during high speed wafer
stage-stepping. These innovations enable an alignment accuracy of 40nm -- a 20%
improvement over the previous model.
ÿÿÿÿThe user-interface console of the FPA-3000i5+ features an upgraded color user-interface
console, similar to that used in the FPA-3000EX5, facilitating easy command input and
high-speed communications.
ÿÿÿÿCanon will introduce its new FPA-3000i5+ at the SEMICON/Europa '98 exhibition in
Geneva, Switzerland, March 31 - April 2, and will begin taking orders for the new stepper in
April. The price of each unit is about US$3.7 million, but will vary according to
specifications. Canon anticipates first-year sales of 150 units.
FPA-3000i5+ Specifications
Lens Magnification 5:1 Reduction Ratio NA 0.45-0.63 Variable Resolution Less than 0.35
micron Exposure Field 22 x 22mm Illumination 365nm Wafer Size Maximum 8 inches
Reticle Size 6 inches Alignment Accuracy Less than 40nm (m+3sigma) Throughput 100
WPH (8-inch wafer, 90mJ/cm2)
ÿÿÿÿThe Semiconductor Equipment Division of Canon U.S.A., Inc., based in Santa Clara,
Calif., is a leading supplier of step-and-repeat and step-and-scan photolithography tools used
in semiconductor fabrication and of large panel aligners for AMLCD flat panel displays. For
more information, please access usa.canon.com .
ÿÿÿÿCanon U.S.A., Inc., is a leader in professional and consumer imaging equipment and
information systems. Headquartered in Lake Success, N.Y., it oversees sales and marketing,
manufacturing, and research and development throughout North, Central and South America
and the Caribbean. |
