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Politics : Formerly About Advanced Micro Devices

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To: Dean Amo who wrote (2455)	10/25/1996 3:17:00 AM
From: (no name provided)	of 1583862

Dean, There are many variations of 0.35um process at AMD. There are the standard 3 layer metals (3LM) which produces the X5 (133Mhz 486) and the current K5. Within this 3LM, there are many sub-variations as well. Most subs are to enchance speeds. I won't go into that. There is also a 4LM forthe 0.35um. However, it never get to use after AMD aquired Nexgen. This is because Nexgen's 586 and 686 are designed on IBM's 5LM process. So we came up with one similar to IBM's. It's a 5ML process and it's the one to be used on the K6. This is quite differ than the above two. Many of the new stuffs are supposes to be on the next generation of process technology, the 0.25um. The most noticable differences beside the 5 layers of metal are: shallow trench isolation and local interconnect. Some people call this a 5 1/2ML because of the local interconnect. So as you can see, not all 0.35um processes are the same. Each addition and deletion may or may not increase the level of difficults in terms of repeatibilty and yields. I hope these help. Regards, Allen

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