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Technology Stocks : General Lithography
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To: nigel bates who wrote (949)3/30/1998 10:52:00 AM
From: Andrew Vance  Read Replies (2) of 1305
 
I read the article and it was very impressive. However we may be talking about apples and doughnuts here. The type of smoothing talked about is on the atomic level which will affect the quality of the surface and/or interface performance of devices created. The IPEC version of CMP would be used first to smooth out the major(gross) 3-D topography on the 1000s of angstrom level.

I hate to use cooking as the example but IPEC CMP goes out and takes a lopside cake and makes it dimensional perfect such that an even layer of frosting can be spread over it. The smoothing in this article you posted attempts to smooth out the airy bubbles on the surface of the cake.

Andrew
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