Sue, regarding BiCMOS, here's a press release that explains it...
IMP Inc. Develops BiCMOS Processes For Data
Communication And Mobile Computer Markets
Released September 3, 1997
IMP, Inc. (IMP (NASDAQ:IMPX)) today announced two new wafer foundry processes for data
communication interface and computer display applications.
Designed for data communication interface applications, the 1-micron C1026 BiCMOS process
features 12V CMOS output drivers and schottky diodes. As an added feature, often needed in
mixed-signal applications, the double-metal, double-poly process includes low temperature
coefficient poly-resistors.
The higher voltage 1.2-micron C1227 BiCMOS process incorporates the 36V high-voltage output
drivers needed in mobile personal computer display and power management applications. The
double-metal, double-poly process features high resistivity, 2k-ohm per square poly-resistors.
"IMP's new high-voltage processes give IC designers access to a high-volume, ISO 9001 facility
with the specialized mixed-signal process technology needed to serve the high growth data
communication and personal computer market segments," said Roger Meade, Director of Foundry
Sales at IMP. He continued, "These new processes are examples of our strong process engineering
capability and ability to develop processes to specific market requirements."
You can find it at impweb.com
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