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Politics : Formerly About Advanced Micro Devices

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To: Maxwell who wrote (31789)	4/12/1998 11:51:00 PM
From: Paul Engel	Read Replies (1) of 1573690

Maxwell - Re :Copper vs. ALuminum You have completely ignored the problem of isolating the copper with barrier films to prevent the copper from diffusing into the remaining films and bulk silicon. These barrier films take up part of the "useful" space reserved for the metal trace - be it copper or aluminum. Effectively, the resultant copper trace will be quite a bit narrower than the lithographic process would allow - thereby negating a good deal of the improvement due to reduced Copper resistivity. Also, the resistance decrease is about 40%, not 50%, in going from Al to Cu. [Aluminum (Pure) Resistivity - 2.824 Micro-Ohms-cm and Copper - Annealed - 1.72 Micro-Ohms-cm]. Paul

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