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Politics : Formerly About Applied Materials

AMAT 267.87

-0.6%

Dec 5 9:30 AM EST

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To: Gottfried who wrote (19004)	4/24/1998 11:29:00 PM
From: Ian@SI	Read Replies (2) of 70976

A couple snippets from SBN... More complete story at pubs.cmpnet.com One definitely wants to be holding onto AMAT prior to the 300MM move... +++++++++++++++++++++++++ INTEL TO 0.13-MICRON IN '99 Intel's big move in the factory next year will be to the next-generation 0.18-micron process technology. "We are now planning for a massive ramp-up of 0.18-micron technology for mid-'99, and the bulk of this year's planned [$5 billion] in capital spending is targeted at that" shift, says Craig Barrett. In Manhattan on Wednesday to talk with Wall Street, the soon-to-be CEO says the chip giant is now qualifying its 4th fab for its 0.25-micron process, which will be used for all MPU production by the end of '98, Rick Boyd-Merritt and David Lammers report in EE Times. BUT NOT 'TIL 2001 FOR 300-MM Intel's transition to next-generation 300-mm wafers is another story. Its move next year to 0.18-micron technology will be on 200-mm wafers, so the shift to the larger platter probably won't come until its shift to 0.13-micron technology, which will occur in the 2001-2002 time frame. "It's taken a lot longer than anyone thought to get to 12-inch wafers," notes Intel's Gordon Moore. "At one time we thought [the shift] would come at 0.25 micron, then at 0.18 micron," he says. "Now we think it will come at 0.13 micron." The move to 300-mm will be an expensive one for Intel. The company currently reuses as much as 64% of its capital equipment when it brings up a new process, but the switch to 12-inch will require purchasing nearly all new fab gear, Moore notes.

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