Elmer, <Sorry John on both points. PII is probably cheaper to produce,>
You must be very technically challenged, Elmer-Boy,
to believe in this statement.
The cost of wafer must be about the same. Same
chemicals, labor, substrate, ~$2500 - $3000 a piece,
right?
With die size 2X of those for K6, each P-II die
must be twice as expensive. Even if you assume the
P-II yield is two times higher, the cost of dies
should be the same at most. If you think more
realistically, say, AMD has >50%, you cannot get
>100% for P-II, and the 2X-yield assumption looks
as an apparent overestimation. Therefore, even
at this point the P-II is not cheaper than K6.
Now go to packaging. Again, the cost must be comparable:
substrate, wire bonds or flip-chip, no big difference.
Now make a 12-layers PCB. Solder 140 add-on components,
on both sides, 5 pieces of cache, thermal plate,
precision pins, spring holders, four plastic pieces...
If you think that all this reduces the P-II cost,
I rest my arguments. |
