GlobeSpan Delivers XDSL2, the World's First, Most Integrated, Dual Channel HDSL Chipset
Dual Channel Design Provides Telecom Equipment Suppliers with Significant Savings in Space, Power and Cost
RED BANK, N.J.--(BUSINESS WIRE)--May 18, 1998-- GlobeSpan(tm) Semiconductor Inc. announced today the worldwide availability of its innovative XDSL2(tm) chipset product line that greatly simplifies the task of adding high-speed symmetric T1 (1.544 Mbps) or E1 (2.048 Mbps) DSL technology to telecommunications equipment designs. GlobeSpan is the first semiconductor vendor to successfully support multiple xDSL transceiver channels on a single chip. By integrating multi-channel digital signal processing (DSP) and framing functions into a single device, GlobeSpan has created the industry's most integrated HDSL chip solution, replacing the function of three separate HDSL chips.
HDSL remains one of the preferred technologies carriers use when installing T1/E1 lines between central offices and business sites. GlobeSpan's highly integrated XDSL2 chipsets provide telecommunications equipment suppliers with the capability to add HDSL functionality to their products as easily as module-based solutions, at a lower cost while offering significant power and space savings. To compliment the dual channel DSP/Framer VLSI, GlobeSpan has also introduced the industry's first dual channel HDSL analog front-end (AFE) chip. The XDSL2 two-chip solution supports two twisted copper pairs and is the first HDSL chipset to interface directly with off-the-shelf T1/E1 transceivers, thereby eliminating the need for a separate HDSL framer to combine and format the two HDSL channels into a standard T1 or E1 interface.
''XDSL2 is clearly the next logical step in HDSL integration,'' said Armando Geday, GlobeSpan's President and CEO. ''By combining all of the digital HDSL functions into one chip, GlobeSpan can provide a single software control program that removes the hassles of integrating three separate functions on our customers' DSL products. This is yet another industry first for GlobeSpan, as the only semiconductor vendor in the industry to combine two HDSL transceivers into a single chip.''
GlobeSpan customers can choose from two versions of the XDSL2 chipset family to meet their requirements anywhere on the planet. The HD2-1200 chipset supports 2B1Q line coding for T1 North American application and E1 for international markets. For applications where maximum reach and loop plant coverage are critical, the HD2-1300 chipset uses high-performance CAP line coding to deliver the industry's best performance with up to 30 percent greater reach than competing HDSL products at T1 or E1 data rates. The HD2-1200 and the HD2-1300 are pin-compatible so that equipment suppliers can meet the needs of both the low-end and high-end markets with a single design. GlobeSpan Semiconductor is the first HDSL chipset vendor to offer pin-compatible HDSL solutions that meet all of the technical recommendations for both U.S. and international markets.
Packaging and Technical Specifications
The dual channel DSP/Framer and dual AFE are both available in small footprint 144-pin TQFP (Thin Quad Flat Pack) packages for high-density configurations with power consumption that meets the needs of the most demanding applications.
The dual channel DSP/Framer leverages GlobeSpan's Billion Operations Per Second (BOPS), software downloadable architecture to provide two standard compliant HDSL channels plus framing on the same chip. The HD2-1200 chipset uses 2B1Q line coding for T1 operation per ANSI TR-28 and Bellcore TA-NWT-001210 and E1 operation per ETSI TS-152. The HD2-1300 chipset uses CAP line coding for T1 operation per ANSI TR-28 and T1E1.4/96-006 and E1 operation per ETSI TS-152. The integrated framer meets the requirements of Bellcore TA-NWT-001211 and ETSI TS-152 and can be configured to support point-to-multi-point and line repeater applications.
Pricing and Availability
The HD2-1200 and HD2-1300 are sampling now, with volume production scheduled for September 1998. They are priced at $75 and $90, respectively, per chipset in OEM volumes. For more information on these products, contact GlobeSpan at 1-888-855-4562 or +1-732-745-7500.
GlobeSpan(tm) Semiconductor Inc., formerly GlobeSpan Technologies Inc., is one of the largest suppliers of DSL modem chipsets that enable users to transfer data over standard telephone copper wire at speeds up to two hundred times faster than today's popular V.34 modems. The Company's founding technical team began developing advanced modem algorithms and a Billion Operations Per Second (BOPS), software downloadable digital signal processor (DSP) at AT&T Bell Labs. Today, GlobeSpan's fourth generation technology and five years of field experience have made it the only company offering production quantities of commercially deployable DSL solutions (ADSL, HDSL, MSDSL, SDSL, RADSL) to more than sixty equipment manufacturers worldwide that represent 80% of the DSL market. GlobeSpan Semiconductor Inc. is based at 100 Schulz Drive, Red Bank, New Jersey 07701 and can be reached via phone at +1-732-345-7570. The Company's Website is www.globespan.net. GlobeSpan(tm) is a trademark of GlobeSpan Semiconductor Inc.
|
