IDT releases info on 0.25µ Winchips, starts sampling:
biz.yahoo.com
The IDT WinChip 2 and WinChip 2 3D will be available in volume later this year, at which time further details will be
available. IDT will be previewing the IDT WinChip 2 3D at the Computex tradeshow in Taipei, Taiwan starting June
2, 1998.
The Winchip-2 has much improved FPU (twice as fast as the original Winchip and I saw on the IDT thread that its die size is miniscule (56mm^2). It will probably max out at 300 or 350 MHz (one speed grade behind AMD). They will also make it in 0.35µ.
Performance gains have been achieved through core CPU improvements combined with the addition of new
0.25-micron process technology, superscalar MMX(TM) capability, a fully pipelined floating point unit and 100-MHz
bus support.
The IDT WinChip 2 family will support Super 7(TM) motherboards, providing the same benefits as the Pentium II(R) architecture for uni-processor systems. The release of multiple core logic chip sets with 100-MHz bus support will ensure that users can continue to leverage the cost-effective and established Socket 7 motherboard infrastructure.
As a result, IDT WinChip 2 PCs will offer better performance for business, MMX and floating-point applications. For home users, the IDT WinChip 2 3D will deliver today's best value PC-level multimedia performance for applications such as gaming, photo editing and education. The IDT WinChip 2 3D incorporates AMD 3DNow!(TM) technology, which accelerates games and applications written to Microsoft's Direct3D(R) application programming interface (API).
''Our goal is to leverage the established and cost-effective Socket 7 industry infrastructure,'' said Glenn Henry, senior vice president of IDT and president of Centaur Technology, IDT's design subsidiary. ''By maintaining Socket 7, we are providing OEMs with an open, flexible infrastructure and helping them avoid costly, proprietary solutions. Most importantly, we re delivering better price/performance than comparable Pentium II processors.''
''The simplicity of our architecture and core enables us to introduce new architectural features such as 3D enhancements, 100-MHz bus support, superscalar execution units and other new technology,'' said Henry.
Petz |
