Fusion News 03/29
SANTA CLARA, Calif.--(BUSINESS WIRE)--March 29, 1996--Integrated Device
Technology, Inc. (IDT), a leader in PC cache solutions, today introduced the
first product using its new Fusion Memory technology, the IDT71F432, a 32K x
32 synchronous pipelined-burst cache memory device, for use with new PC
chipsets from the industry's major chipset suppliers.
Fusion Memory technology allows IDT's 71F432 cache memory device to replace
existing synchronous 32K x 32 pipelined-burst SRAMs with equal performance,
one-third the die size and one-third the active power.
Fusion Memory Establishes New Cost/Performance Curve
"IDT's new Fusion Memory technology brings together the high performance of
SRAM and low manufacturing costs of DRAM to achieve an entirely new
cost/performance point," said Stewart Sando, IDT's director of SRAM
marketing. "Fusion Memory allows IDT to solve high-performance system
functions, such as secondary cache, at significantly lower cost and power
levels, with much smaller areas of silicon. The IDT71F432 demonstrates the
power of Fusion Memory and IDT's ability to bring unique, cost-effective
solutions to the design challenges facing customers."
Through Fusion Memory, IDT brings to the PC market the first cache solution
utilizing single-transistor memory cell architecture. Compared to traditional
SRAMs which utilize a four- or six-transistor cell architecture, the 71F432
is implemented as a one-transistor memory cell, resulting in a 70 percent
reduction in die size. This allows IDT's Fusion Memory devices to support
significantly higher levels of integration and lower costs than were
possible using traditional SRAM technology.
"Adding cache to a system boosts performance 20 percent over systems without
cache. With Fusion Memory, IDT now enables manufacturers to offer this
performance benefit at a lower incremental cost, making it economical for
use in low-end systems that might otherwise be cacheless," added Sando.
"With a much smaller die size, this new memory device promises designers of
PCs an upgrade path to even larger cache sizes. And, since it is one-third
the power of traditional SRAM-based secondary cache, it is well suited for
use in mobile applications."
Fusion Memory Cache Device is Plug-compatible With MoSys' MCache
Compatible with MoSys' MCache device, IDT's 71F432 cache memory replaces
industry standard synchronous 32K x 32 SRAMs and provides 3-1-1-1 burst
cache performance with less than a 0.5 percent performance reduction for
refresh. This Fusion cache device supports Pentium processors operating at
up to 166MHz and runs at speeds of 66 and 75MHz, with clock-to-data out
times of 8.5ns and 7ns, respectively.
Pricing, Packaging and Availability
IDT is currently sampling the IDT71F432 with production quantities available
in May, 1996. The 71F432 is packaged in a JEDEC-standard 100-pin
rectangular plastic thin quad flat pack (TQFP) and will be priced at less
than $5.00 each in volume by the end of calendar 1996. IDT's Fusion cache
memory device is also offered as 256KByte DIMM modules, the IDT7MPV6204/05.
IDT is currently sampling the 7MPV6204/05 Fusion Memory modules, with
production quantities available beginning May, 1996.
About IDT
Integrated Device Technology, Inc. (IDT) designs, manufactures, and markets
CMOS VLSI integrated circuits (ICs) for a range of growth markets, including
desktop computer, workstation/server, data communications and office
automation. IDT offers products in four key areas: high-speed SRAMs, RISC
microprocessors, specialty memories and high-performance logic. The
company's product areas are synergistic and provide solutions that optimize
the cost and performance of microprocessor-based systems. Headquartered in
Santa Clara, Calif., IDT employs approximately 3,875 people worldwide.
This press release contains forward-looking statements. Actual results may
differ materially from those stated depending on a number of factors,
including but not limited to product supply and demand, order cancellations,
pricing, competition and manufacturing yields, particularly as they affect
SRAM products and the Company's ability to obtain and fill orders from
inventory during the balance of the quarter. Please read the section
titled, "Factors Affecting Future Results" in the Company's most recent Form
10Q on file with the Securities and Exchange Commission.
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Note to Editors: Fusion Memory is a trademark of Integrated Device
Technology, Inc. MCache is a trademark of MoSys Incorporated. Pentium is a
trademark of Intel Corporation.
CONTACT:
Integrated Device Technology Inc.
Tami Maggio, 408/492-8699
Caroline Phillips, 408/492-8620
KEYWORD: CALIFORNIA
INDUSTRY KEYWORD: COMPUTERS/ELECTRONICS COMED PRODUCT
MAR 29,1996 |
