ST. PETERSBURG, Fla.--(BUSINESS WIRE)--Plasma-Therm, Inc. (NASDAQ NMS:PTIS) announced today, the shipment of a Versalock(R) High Density Plasma (HDP) deposition system to a high volume manufacturer of thin film heads, located in Northern California.
This system will be used in the development of advanced deposition processes for GMR thin film magnetic heads. High Density Plasma deposition is performed using Plasma-Therm's Inductively Coupled Plasma (ICP) technology.
Dr. Jay Sasserath, the Company's Vice President, Strategic Marketing, stated "We are very excited about the processes which will be developed using this system. Chemical Vapor Deposition (CVD) processes will replace existing thin film technology, offering Plasma-Therm the ability to validate these processes for a variety of applications required to manufacture GMR devices."
Dr. Sasserath added, "In addition, this order represents the first Versalock(R) placement at this particular high volume thin film head manufacturer. This advanced technology, combined with our ability to provide extensive customer support on a global basis, led this customer to select Plasma-Therm over the competition. By placing this system at one of the largest suppliers in the data storage industry, we've further demonstrated the Versalock's(R) acceptance for advanced device manufacturing in this industry."
The statements contained in this release which are not historical facts may be deemed to contain forward looking statements......... |
