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Technology Stocks : Intel Corporation (INTC)
INTC 34.32-1.2%3:59 PM EST

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To: gnuman who wrote (58263)6/18/1998 2:21:00 PM
From: Paul Engel  Read Replies (3) of 186894
 
Gene - Re: "So what is the difference between the cost of solution for Slot 1 and socket 470."

Socket 370.

For Intel, the Slot 1 configuration requires that the Deschutes/Mendocino be first packaged in a BGA package - Ball Grid Array. This is then tested.

The BGA is then surface mounted to PC card along with various resistors/capacitors (no cache SRAMS for Celeron) and the entire assembly must be retested.

For Intel, the latter steps are eliminated and the first step substitutes a Plastic PGA (PPGA) package for the BGA package - only sl;ightly more expensive.

For board assembly makers, the Slot 1 edge connector is replaced by a PGA-type socket. They ELIMINATE the plastic housing that the Slot 1 PC board slides into for support, saving the cost of this component and its attendant assembly costs.

Further, the PGA package will allow the use of a smaller fan and heat sink assembly than that used for the Slot 1 solution.

Lastly, the PGA package will permit a lower profile and smaller footprint, enabling Intel to put the device on a MicroATX PC board - saving PC board cost - which can be housed in a micro-Tower case, also saving costs.

Be happy!

Intel will help consumers save money!

Paul
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