For those who don't know, you can go to TI's website and program in what type of news you want sent to your email box. When I post the news I get, it's simply what I've requested and is far from comprehensive.
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What's New Abstracts:
Advanced Bus (1394, PCi, USB):
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New 1394 Link Layer Chips from TI are Optimized for 400 Mbps Performance
DALLAS (June 15, 1998) -- Designers of PCs, peripheral
equipment and consumer electronics will be able to
increase the data throughput of their systems and products
with any of four new IEEE 1394 (FireWire(TM)) link layer
interface devices from Texas Instruments (TI), the leader
in 1394 silicon solutions. IEEE 1394 provides high-speed
data transmission for throughput intensive applications,
such as digital video and audio, and hard disk drives.
ti.com
Mixed Signal and Analog:
------------------------
New Technical Documents for VOICE BAND AUDIO PROCESSOR VBAP
DATA SHEET, TWL1101, VOICE-BAND AUDIO PROCESSOR (VBAP)
ti.com
Networking (ATM/LAN/WAN):
-------------------------
Diamond Multimedia and Texas Instruments Enable Consumer ADSL Solutions
DALLAS (June 15, 1998) -- Diamond Multimedia Systems, Inc.
(Nasdaq:DIMD) and Texas Instruments (TI) (NYSE:TXN)
announced today that Diamond Multimedia will utilize TI's
ADSL chipset in its upcoming implementations including
splitterless digital modems. The second largest customer-
side modem provider will leverage TI's fully-programmable
solution to bring high-speed Internet connectivity to the
consumer and SOHO markets.
ti.com
Texas Instruments Implements Splitterless Capabilities for ADSL
DALLAS (June 15, 1998) -- Building on the announcement of
its breakthrough ADSL remote access chipset earlier this
year, Texas Instruments today announced the development of
a new software feature that will greatly reduce ADSL
installation complexity and accelerate consumer acceptance
-- all while giving end equipment, PC and modem OEMs more
than 25 times the performance of current modems.
ti.com
TI Business News:
-----------------
Micron Technology to Purchase
Micron Technology, Inc., (NYSE: MU) and Texas Instruments
Incorporated (NYSE: TXN) announced today a definitive
agreement for Micron to purchase the assets of TI's
semiconductor memory business for a combination of common
stock and assumption of debt totaling approximately $800
million (at Micron's current stock price). The transaction
includes the purchase of substantially all of TI's memory
assets, as well as TI's shares in its two DRAM
manufacturing joint ventures.
ti.com
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