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Technology Stocks : Cymer (CYMI)
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To: S. Wallace Slough who wrote (18244)6/23/1998 5:14:00 PM
From: BillyG  Read Replies (1) of 25960
 
thanks for the good DUV news from the Micron article:

<<Appleton said the potential for die-shrink productivity increases was great at
the TI-related fabs, "because right now TI has more wafer starts per month
than Micron does. We just get far more die per wafer. Once we upgrade the
TI fabs with Micron manufacturing technology, we can get the same high
level of die and increase production significantly without adding any
capacity."

The Micron executive said no decision has been made yet on the DUV
lithography vendor for the TI fab upgrading. In Boise, Micron is installing
deep-UV steppers from ASM Lithography, with the goal of producing 85%
of all wafers there on the 248-nanometer excimer laser lines by the end of
the year.

By contrast, TI has relied almost solely on Canon as its lithography vendor
for DRAM fabs. Appleton said Micron will carefully study the mix of
equipment at the new TI DRAM facilities before selecting the DUV tools to
be installed. >>
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