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Technology Stocks : Qualcomm Incorporated (QCOM)
QCOM 166.05+0.6%3:59 PM EST

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To: Sawtooth who wrote (12043)7/5/1998 12:46:00 PM
From: Ramsey Su  Read Replies (3) of 152472
 
Is this news?

Ramsey

SAN DIEGO, CALIFORNIA, U.S.A., 1998 JUL 2 (NB) -- By Sylvia Dennis,
Newsbytes. Qualcomm [NASDAQ:QCOM] has taken the wraps off the
industry's first integrated trimode vocoder mobile station modem,
a device that supports Enhanced Variable Rate Vocoder (EVRC)
transmissions.

According to company officials, the electronics chipset is designed
to be used as a component of CDMA (Code Division Multiple Access) mobile
handsets, and supports all three CDMA vocoder systems: eight kilobits
Qualcomm Code Excited Linear Prediction (QCELP), 13 kilobits QCELP, and
Evrc technology.

The availability of the trimode vocoder, the company says, will allow
mobile phone manufacturers to produce handsets that will work on
different networks and, in the longer run, where roaming facilities
exist, allow CDMA phone users to roam freely between national and even
international networks.

The electronics module is known as the MSM2310 and, thanks to its
small size, Qualcomm predicts that CDMA handsets will start to get
smaller, as well as offering multi network support. The company says
it expects to see regular CDMA handsets dropping in weight to just
four ounces (100 grams) when the electronics are used efficiently.

Donald Schrock, Qualcomm's ASIC (application specific integrated
circuit) division president, said that the company is responding to
its customers' needs with the new module.

In early carrier testing of the MSM2310, he said, superior results
and performance were seen.

Newsbytes notes that the MSM2310 is built upon Qualcomm's fourth
generation MSM2300 architecture, as used in worldwide CDMA phone
production. This includes proprietary CDMA building blocks, a
microprocessor and several DSP (digital signal processor) cores
integrated onto a single chip.

Production quantities of the MSM2310 are now available in two sizes,
the 196 ball plastic ball grid array (PBGA) package and a 176-pin thin
quad flat pack (TQFP) package. The 196-ball PBGA packages have a high
lead count per area, and unlike (TQFP), require no additional board
space for lead extensions outside the package body, the company says.

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