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Politics : Formerly About Advanced Micro Devices
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To: Jim McMannis who wrote (34050)7/8/1998 4:40:00 PM
From: Time Traveler  Read Replies (1) of 1571681
 
Given the same die foot print, a shrink from 0.35um to 0.25um should yield twice the number of dice on the same size wafer. However, the power handling capability reduces. To get the power handling capability up again, you have to increase the die size by adding more functions to the chip. Hey, both Intel and AMD now are talking about incorporating the L2 cache right onto the silicon.

Time Traveler
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