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Technology Stocks : IDTI - an IC Play on Growth Markets
IDTI 48.990.0%Mar 29 5:00 PM EST

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To: Scumbria who wrote (9107)7/8/1998 9:14:00 PM
From: wmf  Read Replies (2) of 11555
 
>>The packaging and testing costs of chips is beginning to exceed the >>manufacturing cost of the dies. By incorporating several individual >>chips into one piece of silicon, the total packaging/testing cost is >>greatly reduced.

Hmmm. Not really sure about that. For processors the package quite certainly constitutes a big part of the cost. Memory chips, though, go into inexpensive plastic packages. For the integrated chip you might actually end up with a more expensive package because you exchange one big package with tight processor specs against a small package with tight specs and another small package with loose specs.
Also I do not really see test advantages. Each of the components of the integrated chip will have to go through the same time consuming test procedures as the individual chips separately. Test time will remain the same. Handling time might be better for the system-on-a-chip but then again the handling time is only a small part of the whole thing.
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