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To: LLCF who wrote (1760)	7/24/1998 10:48:00 PM
From: Ian@SI	Read Replies (1) of 2946

Extract from: news.semiconductoronline.com Finally, SVG announced the RVP-300 rapid vertical furnace for 300 mm wafers. The furnace, which ramps temperature up at 100øC/minute, is the first to demonstrate arsenic-doped TEOS films on 300 mm wafers. Multiple systems shipped to a major DRAM manufacturer in the first quarter of 1998. If the major DRAM maker is USA, then it would be nice to sell MU some micrascans to go along with these furnaces. ... but given that this was a 300 mm sale, I suspect it went to the Siemens-Motorola joint Venture. Does anyone know whether that pilot line was intended to be Memory, Logic or ??? ? Ian.

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