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Politics : Formerly About Advanced Micro Devices
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To: Yousef who wrote (35121)7/26/1998 10:09:00 PM
From: kash johal  Read Replies (2) of 1572777
 
Yousef,

I think you are spot on with this.

In Very deep sub-micron the loading capacitance is by far the limiting factor on overall chip performance. The use of low K dielectrics will be much more relevant at 0.18, 0.13 and even 0.1 than Cu.

One can solve the electromigration problems with thicker power/gnd rails etc.

So in 0.18 micron or even 0.13 one would rather have low K dielectrics than Cu if that was the tradeoff.

Ideally you want both, but Intels approach makes a lot more sense to me than the rush to Cu. It seems to be logical and methodical.

Having said that, I suspect IBM at least has the low K dielectric program under way just like Intel.
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