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Politics : Formerly About Advanced Micro Devices
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To: Maxwell who wrote (35178)7/29/1998 10:02:00 AM
From: Yousef  Read Replies (3) of 1572508
 
Maxwell,

Re: " Have you heard of Dual Damascene? Well it goes as followed:"

I am very disappointed in your technical understanding ... the process
flow that I originally gave you was for a dual Cu damascene process flow.
Your flow won't work ... want to explain how you do contact masking and trench
masking at the same time as well as the etch ... didn't think so.

Re: "Smaller die means I can make my FET smaller with smaller Leff. Smaller
transistor means lower power dissipation."

Actually Maxwell, smaller Leff will mean more drive current (Idsat) which
will increase the power of that small FET. The way to reduce power is
to lower the operating voltage ... funny, you didn't mention that.

Re: "As for low K, SOG such as flowable oxide ..."

I believe in your original post, you were talking about Fluorinated HDP,
not SOG films ... trying to change the subject material, Maxwell. <ggg>

Re: "Anyway so much talking to you. Your company will go to copper eventually
and you will see that I am right."

Maxwell, I don't think I ever said that Intel would never go to Copper ... just
not for the .18um generation. Beyond that, I expect that Intel will use
Copper in their .13um process.

In closing Maxwell, your post was very poor on technical details and you
obviously don't know nearly as much as you claim.

Make It So,
Yousef

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