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Technology Stocks : Ultratech Stepper
UTEK 30.230.0%Jun 5 5:00 PM EST
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To: Clarksterh who wrote (2625)7/31/1998 6:14:00 PM
From: Andrew Vance  Read Replies (1) of 3696
 
That is a difficult question to answer but I will try. As we shrink device technology, we are also seeing an increase in the number of layers. Sometimes it is a very critical layer like Poly and other times it is the addition of implant or interlevel dielectric levels. It is my opinion that the number of layers going to 0.18u from 0.25u or 0.35u are close to identical. The question is whether the additional implant or interlevel dielectrics/metallization layers are moving into the sub 0.50u regime. I do not think there is a big push here so my gut feel is that the % critical layers will remain the same or slightly decrease for the total process.

So, for my guess, I say it will be a 50/50 mix of critical versue non critical levels with the pivot point being the 0.35u dimension. I would love to hear other inputs.

Andrew
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