Ultratech Stepper Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Ultratech Stepper

UTEK 30.23

0.0%

Jun 5 5:00 PM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Andrew Vance who wrote (2626)	7/31/1998 7:18:00 PM
From: Clarksterh	Read Replies (3) of 3696

Andrew - Thanks for the info. Guess I'm going to have to dig some more. Although I know a reasonable amount about semi manufacturing equipment, I know next to nothing about device design. Just FYI, the reason I'm curious is that there is a multiplier effect for the manufacturers of DUV equipment if currently all DUV manufacture uses DUV for only one or two layers, but in the next generation it is 4 or 5. Eventually this multiplier effect is practically guaranteed to happen (I can't imagine them using many 0.5u layers when the smallest layers are 0.08u, just from the standpoint of not being able to fit in all of the interconnects.). The question is over what timeframe. Clark PS What layers is it that typically use the largest dimensions? I assume interconnects, but what else?

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next