Carl, acidman was referring to e-beam, which if memory serves, is an electron beam, you could not shave your beard with less so etch a wafer. Electrons are very light animals and before you can impart much energy to dislodge an atom from a surface you build up a charges preventing additional milling. I am not sure that acidman understands how the excimer laser is used, I think he is under the impression that the laser beam is used as a futuristic weapon to actually cut vias and other features by "flash evaporation" directly on the wafer, the lithographic step and the role of the laser in lithography is not what he had in mind.
By the way, a small outfit, Resonetics, actually does use excimer lasers to drill holes and cut "fine" features, but they ain't talking submicron or anything close to that (VBG), but acidman probably is under the impression that the brute force (or should I say "energy density" ?) of the excimer laser is what is at work here. Well Carl, I usually do not get into pugilistic exchanges, but the word "density" creates a very strong association with acidman.
Zeev |
