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Politics : Formerly About Applied Materials

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To: akidron who wrote (22968)	8/13/1998 9:12:00 AM
From: Katherine Derbyshire	Read Replies (4) of 70976

Regarding 300mm being skipped.... That topic came up a couple times at Semicon West. From what my sources were telling me, equipment companies and especially wafer companies have sunk HUGE amounts of money into 300mm. They do not have the will or, more importantly, the resources to write all of that off and skip to the next generation after that. If the chip makers want >300mm equipment, the feeling I get is that they will have to write some checks to fund development. Also, the real reason that 300mm is being delayed is that die shrinks are happening faster and more successfully than expected, which means the economics of 200mm wafers are remaining viable longer than expected. 300mm wafers (and, by extension, larger wafers) simply do not make economic sense at current die sizes. I had a very interesting discussion about these issues with the Chartered Semiconductor process people a while back. For those wanting more info, you might take a look at news.semiconductoronline.com Katherine PS In light of recent debates about motives, some might question the link to my own commercial site. I simply don't feel like re-writing analyses that are already web accessible. If you're offended, don't follow the link. PPS Yes, I'm a little testy. Sorry.

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