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Technology Stocks : MEMC INT'L. (WFR -NYSE) The Sleeping Giant?

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To: Zeev Hed who wrote (3697)8/13/1998 4:49:00 PM
From: olduvai5  Read Replies (1) of 4697
 
Hi Ze'ev, a late response to your earlier question. Harris deposits the oxide, reportedly because controlling total thickness is easier. I don't know quite how this is done, but it is not done by implantation. There is some sort of surface treatment which reduces the wafer cross section significantly. Then, another wafer is bonded to it and the bonded wafer is then polished to the desired thickness.
This is actually a good market for the reject wafers that the premium producers lose along the process way. I haven't been able to figure out why SEMX hasn't been able to do better at this. They've been in the toilet since last year.

olduvai5
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