Paul, Re: "If the system designs do not provide enough heat removal, the junction temperature
of the CPU chip may exceed safe operating limits (usually around 125 to 150 C at
the CPU silicon surface - not the case temperature)."
Do you happen to know how (hopefully somehow) Intel does prediction of temperature rise in chips, modules and systems? There are simulation tools, such as finite element analysis, that will accept 3D packaging dimensions, power dissipation of all components in the package, cooling air velocity and volume, and other pertinent inputs, and predict temperatures anywhere in the package. Intel, through its long string of microprocessor, chipset, mobo and server node designs, certainly has all the experience to be able to come up with all the parametric data to plug into any simulation system. Just wondering (hope they aren't skipping an important step in the overall chip to system development process).
Tony |
