SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Teradyne
TER 195.06+2.4%Dec 19 3:59 PM EST
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Mason Barge who wrote (813)8/27/1998 9:39:00 PM
From: Sleeperz  Read Replies (1) of 1184
 
Fujitsu's Super CSP can be tested in wafer form

By Yoshiko Hara

TOKYO - Reversing the conventional fab sequence, a Fujitsu
Ltd. scheme packages all the devices on a wafer before dicing
them into separate chips. The so-called "wafer molding"
technique, demonstrated here last week, enables processing in
one batch, from fabrication to assembly, Fujitsu said, and
permits testing in wafer form.

eet.com
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  

HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2025 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News