Formerly About Applied Materials Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Applied Materials

AMAT 220.17

-6.4%

3:59 PM EST

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Big Bucks who wrote (23846)	9/5/1998 9:49:00 PM
From: Katherine Derbyshire	Read Replies (3) of 70976

>> EUV and DUV (extreme and deep UV) lithography as well as Xray lithography and high density inductive ot transformer coupled plasma etching is hot and gaining momentum for sub 0.25uM features<< I agree with you re: etch, but beg to differ re:litho. EUV is way out. Sub-0.10 micron, if ever. X-ray is not quite as far out, maybe 0.13micron or so, but is also very much an "if" not a "when." DUV (248nm) is the thing for 0.25-0.18, with 193nm probably coming in after that. Katherine

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next