Tessera Inc. said it will begin manufacturing its chip-scale packaging products
in a new plant based in Singapore starting this month.
San Jose, Calif.-based Tessera's new 3,000- to 4,000-sq.-ft. plant in
Singapore is capable of manufacturing about 1 million of the company's
MicroBGA chip-scale packages (CSPs) per month. Designed for
camcorders, cameras, cellular phones, and other products, Teserra's
MicroBGA CSPs are up to 80% lighter and smaller than conventional chip
packages, the company said.
The new plant in Singapore, which is expected to move into volume
production in the next six months, will support Tessera's customers
throughout Asia, according to Michael Warner, vice president of product
development for Tessera, at a seminar held by the company in Hsinchu,
Taiwan on Tuesday.
Tessera does not plan to build a manufacturing plant in Taiwan, however. But
the company is aggressively pushing its MicroBGA CSP technology among
Taiwan's IC packaging companies, considered some of the world's largest.
So far, though, Tessera has yet to license its technology to a Taiwan-based
company. "We expect Taiwan will play a major role in chip-scale packaging
in the future," Warner said.
Still, Tessera has gained strong momentum for its technology in Japan, Korea,
and the United States. So far, it has announced several licensees for its
MicroBGA CSP technology, including 3M, Amkor Electronics Inc., Flextech
Holdings, Hitachi Ltd., Hitachi Cable America Inc., Hyundai Electronics
Industries, Intel Corp., LG Semicon Inc., Mitsui High-Tec Inc., Rambus Inc.,
Samsung Electronics Co. Ltd., SGS Thomson Microelectronics Inc., Shinko
Electric America Inc., Sony Corp., and Texas Instruments Inc. |
