Intel Investors - Intel Will be Implementing TWO 0.18 micron processes, not just one!
Craig Barrett described the bifurcation of processes required to optimize CPUs or chip sets.
Apparently, Intel is leapfrogging their OLD methodology and are now designing their new integrated chip set (Whitney) in a 0.18 micron process but it requires a denser set of metallization design rules.
Accordingly, Intel seems to be developing a modified 0.18 micron process with thinner metal layers (probably tighter metal pitches as well) for the chip set/graphics combination.
That is really getting aggressive !
Here's the article describing the two processes.
Paul
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edtn.com
Top Technology Story: EE Times
Intel foresees fork in its process road map
By Rick Boyd-Merritt
PALM SPRINGS - Intel Corp. is positioning itself to put as much
of its manufacturing clout behind low-cost, highly integrated
peripheral chips as it traditionally has placed on its high-end
microprocessors.
In a small group meeting here before delivering a keynote
address at its Intel Developer's Forum, Intel president and chief
executive officer Craig Barrett revealed the company is currently
ramping up in tandem two "mainstream" 0.18-micron logic
processes - one that would be geared for the needs of its
high-end processors and another tailored to the requirements of
its core logic, graphics and embedded semiconductors.
"In the past, we developed one logic process for our high-end
microprocessors and all our other chips used that process as it
became trailing-edge technology," Barrett said in a Monday night
meeting with a small group of editors. "But now we are chunking
out a lot of i740 [graphics controllers] and core logic and we want
them to have the smallest die size possible."
While both logic processes would use the same basic equipment
set, they would diverge in design rules, he added. The processor
technology would be geared toward fast switching of large signal
loads while the peripheral-chip process would aim at thinner
metalization layers, he said.
The process-technology divergence first emerged in the
0.25-micron generation, in which much of Intel's Pentium II family
is currently made, Barrett added. But with the 0.18-micron
generation set to be in volume production by mid-1999, the two
processes for the first time would be distinctly defined from the
start.
The new peripheral process could be a sign Intel is ready to put its
considerable manufacturing muscle behind integrated processors
that would compete with the likes of National Semiconductor's
"PC-on-a-chip," which is expected to ship next June. Intel plans to
ship a merged core-logic/graphics chip set next year, dubbed
Whitney, and analysts have speculated that beyond the
0.18-micron generation, it would make sense to integrate Intel's
Celeron processors with north bridge core logic and graphics.
"You are definitely going to see integrated computing at the low
end with graphics, processors and so forth," Barrett said. "And
you want to be as cost-effective as possible at that low end."
The process-technology divergence comes at a time when much
of the industry is seeing a significant slump, in part attributed to
the Asian financial crisis and slack PC demand early this year.
Responding to the downturn, Intel cut its capital-expenditure plans
from about $5 billion to about $4.6 billion this year, mainly through
delaying plans to start a 300-mm, 0.13-micron wafer fab in the
Fort Worth, Texas area, Barrett said.
"Basically, the whole industry has decided to push off 300 mm
until the 2002-2003 time frame," Barrett added. "We aren't going
to be the first ones to pioneer it, and it's not clear at this point who
is."
Despite the downturn, Intel reported last week it expects its
third-quarter revenues to be up 8 to 10 percent over
second-quarter revenues. It attributed the uptick to increasing PC
demand in North America and Europe. |
