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Thursday September 24, 5:02 am Eastern Time
Company Press Release
Applied Materials and Nanometrics Sign
Exclusive Agreement for In-Line Thickness
Metrology on Mirra CMP System
Integration of NanoSpec(R) 9000 Dry Wafer Thickness Measurement Technology Targets Enhanced Process Control and Increased Productivity
SUNNYVALE, Calif.--(BUSINESS WIRE)--Sept. 24, 1998-- Applied Materials, Inc. and Nanometrics (Nasdaq:NANO - news) have signed a strategic joint development agreement that gives Applied Materials
exclusive rights to integrate Nanometrics' NanoSpec 9000 dry wafer thickness metrology technology on Applied Materials' Mirra(R) CMP (chemical mechanical polishing) system.
Having this metrology capability as an option on the Mirra dry-in dry-out configuration is expected to help chipmakers more precisely control their dielectric CMP process for increased performance and productivity.
Gino Addiego, general manager of Applied Materials' CMP Division, said, ''Nanometrics' NanoSpec 9000 film metrology system, which is a metrology solution for dry-in dry-out CMP, will be an excellent addition to the line of integrated metrology solutions complementing our Mirra CMP system. Integrated thickness metrology can
have a positive impact on CMP system economics for our customers by maximizing consumable life, extending
maintenance intervals and reducing monitor wafers, among many other benefits.''
John Heaton, president and CEO of Nanometrics, said, ''We are pleased to collaborate with Applied Materials in the pursuit of better process control and system utilization. By combining our expertise in metrology with the industry's leading CMP system, we expect to provide chipmakers with advanced process control to increase
yields and improve overall equipment effectiveness.''
The Mirra CMP system is the market leader in CMP for semiconductor devices using geometries of 0.25 micron and below. Its multi-platen architecture enables a high degree of flexibility to accomodate every type of dielectric film layer with remarkable productivity and precision. The system also offers processes for various
metal films, including tungsten; a process for planarizing copper films in dual damascene designs is in an advanced stage of development.
Nanometrics, Inc. is a leading supplier of automated metrology equipment for advanced IC, flat panel display and magnetic head manufacturing. Nanometrics is traded on the Nasdaq National Market System under the symbol, ''NANO.'' The Company's web site is nanometrics.com.
Applied Materials, Inc. is a fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the
Nasdaq National Market System under the symbol, ''AMAT.'' Applied Materials' web site is appliedmaterials.com.
Contact:
Nanometrics, Inc.
Paul Nolan, 408/746-1600 ext. 122 (financial community)
Roger Ingalls, 408/746-1600 ext. 101
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Applied Materials Inc (Nasdaq:AMAT - news)
Nanometrics Inc (Nasdaq:NANO - news)
Related News Categories: computers, semiconductors
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