Winbond Electronics Names ESI Preferred Supplier with a $2 million Order for Multiple Memory Yield Improvement Systems
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oPortland, Oregon (October 2, 1998) - Winbond Electronics of Taiwan named Electro Scientific Industries, Inc. (NASDAQ - ESIO) preferred supplier of memory repair products with a multiple unit order for ESI Model 9300 Memory Yield Improvement Systems.
The systems, being installed at Windbond's Test Line Four in Hsinchu, Taiwan, will be used to improve production yield of 64Mb DRAMs.
George Chou, Manager, Winbond NVM Product Engineering Department, commented on the selection of ESI. “ESI's superior product performance, together with the small spot size and patented 1.3 µm wavelength, supplies us with the enabling technology we need for our .25 µm process efforts.”
About Winbond
Winbond Electronics was established in 1987 in the Hsinchu Science-based industrial park, Taiwan. After ten years of continued growth, Winbond provides turnkey solutions from product design, production, marketing and system development. The company currently has a total of more than 3,000 employees (including overseas branches). Its eight main products include foundry services and integrated circuits for memory applications, data communication, microcontrollers, multimedia, personal computers, speech, telephony and visual communications. |
