To All,
Just to show that there is *some* life in semi equipment:
Caesar Technology Orders 90 Kulicke & Soffa Wire Bonders
WILLOW GROVE, Pa.--(BUSINESS WIRE)--Oct. 8, 1998--Caesar Technology Inc. has ordered 90 Kulicke & Soffa
(NASDAQ:KLIC - news) Model 8020 gold ball bonders for its Taiwan semiconductor assembly facility.
Delivery is scheduled to begin in the December quarter.
According to C.Y. Hsu, operations vice president of Caesar Technology, the bonders will be used mainly to manufacture fine pitch ball grid array (BGA) packages.
''The decision to purchase K&S Model 8020 bonders was based on the machines' ability to produce very complex, fine pitch, high-pin-count BGA packages,'' Hsu
said. ''We are also very satisfied with the applications support K&S has provided.''
''Caesar Technology is a longstanding customer with whom we enjoy an excellent relationship,'' said K&S Vice President & General Manager Dave Leonhardt.
''We will continue to work closely together, with K&S providing industry leading assembly capability and support, to help Caesar produce the increasingly complex
devices its customers demand.''
Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The company serves the integrated circuit assembly market with a product line
that includes wire bonding, die bonding and wafer dicing equipment, as well as packaging material, including bonding wire, capillaries, wedges, die collets and saw
blades, and has sales and service facilities worldwide.
The company web site address is www.kns.com. |
