Craig,
<<<<Is the Intel processor a power hog? Do the Ancor ASICs have cooling fins? If the MKII-8 dissipates 115W what fraction is not from the power supply? If not for the need to accommodate 8 GBICs, couldn't the PCB be quite small?>>
Unfortunately, I don't know where the majoritity of the power goes in the MKII. I don't recall seeing any heat sinks on the ASICs, or on the I960. If you didn't have the 8 GBICs you wouldn't be able to connect anything to the switch. <g>>>
Then the switch would be even smaller. No, my point, of course, was that I/O would consume a fair percentage of the board real estate. Just like die size is often limited by the bonding pads, the accommodation of the GBICs probably makes the PCB bigger than it would have to be. If the package weren't meant to be rack mounted, the GBICs would not have to be strung out on just one side of the board.
<<I could be wrong on this, but it appears as if the SilkWorm could be using a plastic case>>
This is interesting. If this is true, the market must not demand rugged packaging.
Thanks for your thoughts,
Greg
P.S. A sales/earnings contest this quarter would be quite interesting, with guesses all over the map. Will they recognize all or just part of the INRANGE funds? How much from Hucom? Will they even report a profit? Will they allow individual investors to participate in the conference call? |
