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Politics : Formerly About Applied Materials

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To: Katherine Derbyshire who wrote (25707)	10/23/1998 6:30:00 PM
From: Math Junkie	Read Replies (1) of 70976

<<Using a standalone inspection tool to determine endpoint for an etch or CMP step, for instance, would mean removing the tool from the chamber, inspecting it, and putting it back, repeatedly.>> Do you mean removing the tool from the chamber or removing the wafer? I can see how there would be specific applications where it could make sense, particularly in process control examples such as you cited; I was referring to defect detection tools in general. I do think your points about the need for independence and impartiality in dealing with fabs are important ones, by the way.

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