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Politics : Formerly About Advanced Micro Devices
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To: RDM who wrote (40281)10/29/1998 2:12:00 AM
From: Tenchusatsu  Read Replies (1) of 1573432
 
<AMD frequently chooses more aggressive layout rules than Intel resulting in many times a smaller die size and more yield candidates per wafer.>

Thanks for pointing that out, RDM. I've always suspected this was the case in the 0.25 micron process, but I never knew that this was a regular pattern between AMD and Intel.

Microprocessor Report points out that IBM has the luxury of trying out new technologies which may be tricky to implement because their volumes aren't quite as large as Intel's. Perhaps the same goes for AMD, who's low volumes (relative to Intel) allows them to try more aggressive rules. Intel, on the other hand, can't really afford to do that, since any hiccup in implementation would lead to a huge negative spike in their profitability.

That's one reason why Intel isn't going to copper until the 0.13 micron generation. The technology for copper still isn't established yet, despite IBM's announcements. This, of course, is a pretty risky assumption on Intel's part, and only time will tell if Intel made the right decision. On the other hand, AMD as a smaller, lower volume company has less to lose by being more aggressive with copper. It's the typical drive of an underdog.

Tenchusatsu
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