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Politics : Formerly About Applied Materials

AMAT 226.05

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Nov 14 9:30 AM EST

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To: Proud_Infidel who wrote (25947)	11/3/1998 5:13:00 PM
From: Proud_Infidel	Read Replies (1) of 70976

Fujitsu to upgrade Ore. fab to 0.22µ Will put cap on 64 Mbit DRAM production By Jack Robertson Electronic Buyers' News (11/03/98, 01:58:41 PM EDT) Fujitsu Ltd. today denied published reports by Nikkei Publications that the firm was curtailing its DRAM operations. On the contrary, the company reported that it is actually beefing up the memory capability in its Eugene, Ore. fab to 0.22 micron wafer processing. Production at the leading edge process starts early next year in the U.S.fab, said Kazunari Shirai, president of Fujitsu LSI Devices group. However, Shirai said his firm will hold production of 64 Megabit DRAMs level at 3 million chips a month. Since the die shrink will yield more 64-Meg chips per wafer, Fujitsu will use the extra capacity gained on the Gresham lines to make embedded DRAMs in a new logic product. ebnews.com

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