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Technology Stocks : General Lithography

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To: James Word who wrote (1100)	11/6/1998 3:16:00 PM
From: Nick Michell	of 1305

Applied Materials Announces Breakthrough Low k Dielectric Film For High-Speed Copper Chips Anyone have any comments on this? biz.yahoo.com Interesting Statement: "Black Diamond will be introduced as a family of low k dielectric films that are expected to extend to a dielectric constant of k less than/equals to 2.4. The first product, named BD27, with a dielectric constant of 2.7, was designed for 0.18-micron technology." 0.18 technology will be here next year from at least a couple of companies. Does anyone think this stuff could be used IN PRODUCTION anytime soon, or is this all still a number of years away? As a chip designer, if I knew this would be available within, say, 2 years, I might start changing my plans right now. A dielectric constant of 2.7 would be a big advance over the 3.9 I use now and the 3.5 or so that might be available to me in the near future. Does AMAT's integrated design center give them a big competitive advantage in copper and low-k? What does this do to point tool suppliers like Semitool and SpeedFam? Nick

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