Siemens Announces First Silicon of 64M/72M Direct Rambus DRAMS; Siemens Direct RDRAMs Are Industry's Smallest
CUPERTINO, CALIF. (Nov. 9) BUSINESS WIRE -Nov. 9, 1998--Siemens
Semiconductors announced the first functional silicon of 64M/72M Direct
Rambus DRAMs (Direct RDRAM).
At only 58mm(2) die size, these chips are the industry's smallest
64M/72M Direct RDRAM parts. Siemens' Direct RDRAMs are manufactured in
0.20um process technology and are mounted in a micro ball grid array
package. The first samples are being evaluated and will undergo
exhaustive functional testing. First engineering samples for customers
will be available end of 1998. Mass production of 64M/72M Direct RDRAMs
is scheduled for mid-1999.
The Direct RDRAM is a high-performance DRAM designed for use in
personal computers, workstations, servers, graphics, consumer
electronics as well as other applications that require very fast data
rates. These memories offer a bandwidth of 1.6 Gigabytes per second by
using the Rambus high-speed memory interface technology. Direct RDRAMs
are intended to provide the bandwidth required for the next generation
of processors which will start shipping the second half of 1999.
"I am extremely pleased with this excellent achievement of our
engineers," said Dr. Andreas von Zitzewitz, president of the memory
division of Siemens Semiconductors. "With our 0.20um process, Siemens
is using the most advanced technology and offering the smallest 64M/72M
die of any Direct RDRAM silicon known today. Other manufacturers with
less advanced technology will face major issues going through the
process of optimizing manufacturing, processes and yields for these
extremely demanding, very high-performance memories."
"Siemens' Direct RDRAMs implemented in 0.20um will enable Siemens to
ramp quickly to high production rates," said Allen Roberts, vice
president and general manager of Rambus Inc. "Siemens production plans
will help meet the PC OEM's high demand for Direct Rambus main memory
components."
Rambus Inc., based in Mountain View, Calif., develops and licenses
high-speed chip-to-chip interface technology that enables semiconductor
memory devices to keep pace with faster generations of processors and
controllers.
"With the first functional 64Mb/72Mb Direct RDRAM silicon produced by
Siemens' 0.20um lines, this timely availability positions Siemens as a
leading memory supplier," said Sherry Garber, senior vice president of
Semico Research Corp., a marketing and engineering research company
based in Phoenix, Ariz. "To bring out both 256Mbit SDRAM and Direct
RDRAM at 0.20um is a real manufacturing coup."
The first functional silicon of 64M/72M Direct RDRAM devices marks an
important step in the Siemens technology roadmap. Along with the new
Direct RDRAMs, Siemens intends to offer its customers a wide range of
high speed DRAM architectures including Double Data Rate DRAMs and
SLDRAM.
Siemens' Semiconductor Group is a leading worldwide provider of
integrated circuits, memory products, RF components and discrete, power
and opto semiconductors and fiber optic components. The comprehensive
product line of Siemens Semiconductors serves a wide range of customers
active in communications, wireless, computer peripherals,
automotive/industrial and consumer electronics. Siemens
Microelectronics is its U.S. affiliate. In fiscal 1996/97, the
Semiconductor Group achieved sales of $3.5 billion (DM 5.9 billion) and
employed 22,600 people worldwide. For more information, please see
www.smi.siemens.com.
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