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Politics : Formerly About Advanced Micro Devices
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To: Elmer who wrote (41503)11/15/1998 12:35:00 PM
From: kash johal  Read Replies (1) of 1574102
 
Elmer,

Nice description of bin testing......agreed.
Mosts folks do test wafers at hot I believe as well as packaged parts.
Cold testing is non-trivial and messy.

As far as testing BSB you are dead wrong.
Folks like HP have testers that can test at speeds greater than 1Ghz.

Check em out.

Regards,

Kash.

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